IEEE T ADV PACKAGING期刊全称叫什么

IEEE T ADV PACKAGING是IEEE TRANSACTIONS ON ADVANCED PACKAGING期刊的缩写。IEEE T ADV PACKAGING期刊的出版地是UNITED STATES，。

该刊的年访问量是0篇，发行周期是Quarterly，从官网http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6040上查到本刊的通讯地址是IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141，投稿地址是http://mc.manuscriptcentral.com/tadvp-ieee。网友对该刊的审稿速度给与的评价是平均6月，录用比一般是约50%。